Semiconductor device and method of fabricating the same

ABSTRACT

A semiconductor device such as a phase change memory device includes a semiconductor substrate including an active region, a conductive pattern disposed to expose the active region, an interlayer dielectric pattern provided on the conductive pattern and including an opening formed on the exposed active region and a contact hole spaced apart from the opening to expose the conductive pattern, a semiconductor pattern and a heater electrode pattern electrically connected to the exposed active region and provided in the opening, a contact plug connected to the exposed conductive pattern and provided to fill the contact hole, and a phase change material layer provided on the heater electrode pattern.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application claims the benefit of foreign priority under 35U.S.C. §119 to Korean Patent Application No. 2006-95915 filed on Sep.29, 2006, the entirety of which is hereby incorporated by reference.

BACKGROUND

Embodiments of the present invention relates to semiconductor devicesand methods of fabricating the same. More specifically, embodiments ofthe present invention are directed to a semiconductor device such as aphase change memory device and a method of fabricating the same.

With the advance in electronic industries such as mobile communicationsor computers, there is a requirement for semiconductor memory devices tohave characteristics such as a high read/write speed, non-volatility, alower operating voltage. However, recently developed memory devices(e.g., SRAM devices, DRAM devices or flash memory devices) do not meetthese characteristics.

For example, a unit cell of a DRAM device includes one capacitor and onetransistor configured to control the capacitor. Accordingly, the DRAMdevice has a larger unit cell area than a NAND flash memory device.Further, because the DRAM device includes the capacitor in which data isstored, it is a kind of volatile memory device that requires a refreshoperation. While an SRAM device has a high operation speed, it is also akind of volatile memory device. Because a unit cell of the SRAM deviceincludes six transistors, the SRAM device has a considerably large unitcell area. While a flash memory device is a kind of non-volatile memorydevice and provides the highest integration density (especially, in caseof a NAND flash memory device), it is well known that the flash memorydevice has a low operation speed.

Accordingly, memory devices having a high read/write speed, which arenon-volatile, which do not require refresh operations, and which have alow operation voltage are being studied. A phase change random accessmemory (PRAM) is becoming attractive as one of the next generationmemory devices capable of meeting the above-mentioned requirements. Forexample, because a PRAM device can rewrite data 10¹³ times or more, ithas advantages as follows: (1) long lifespan; and (2) higher operationspeed than 30 nanoseconds.

The data stored in a memory cell of a PRAM may be read out by sensingthe resistance change caused by change of a crystalline state of a phasechange material layer. The crystalline state of the phase changematerial layer is dependent on heating temperature and heating time ofthe phase change material layer. In the PRAM, a state of the phasechange material layer is changed to a desired state by controllingcurrent flowing at the phase change material layer and Joule's heatgenerated by the current. As well known, the Joule's heat (Q) may begiven by Joule's Law.

Q∝I¹Rt   [Equation 1]

Resistance (R) is a fixed parameter that is dependent on a kind ofmaterial or fabricating process, whereas time (t) and current (I) areparameters for the operation of products and externally controllableparameters. Thus, resistance of a portion where the phase changematerial layer is heated is necessarily increased to heat the phasechange material layer up to a required temperature while minimizingpower dissipation.

From a standpoint of a semiconductor memory device including a phasechange random access memory, an increase in operation current (I_(on))is required to achieve a high integration and a high speed operation.Resistance elements having an effect on the operation current of thesemiconductor memory device are metal resistance, contact resistance,and active region resistance. These resistance elements decrease theoperation current of the semiconductor memory device to degradeoperation characteristics of the semiconductor memory device.

SUMMARY

Embodiments exemplarily described herein are directed to semiconductordevice such as a phase change memory device and a method of fabricatingthe same.

One exemplary embodiment can be characterized as a semiconductor devicethat includes a semiconductor substrate having an active region; aconductive pattern disposed on the semiconductor substrate, wherein apredetermined region of the active region is exposed by the conductivepattern; an interlayer dielectric pattern provided on the conductivepattern, the interlayer dielectric pattern including an opening and acontact hole spaced apart from the opening, wherein the opening exposesthe predetermined region of the active region and the contact holeexposes the conductive pattern; a semiconductor pattern provided in theopening and electrically connected to the exposed active region; aheater electrode pattern provided in the opening and electricallyconnected to the semiconductor pattern; a contact plug substantiallyfilling the contact hole and connected to the conductive pattern; and aphase change material layer provided on the heater electrode pattern.

Another exemplary embodiment can be characterized as a method of forminga semiconductor device that includes forming an active region in asemiconductor substrate; forming a conductive pattern exposing apredetermined region of the active region; forming an interlayerdielectric pattern on the conductive pattern, the interlayer dielectricpattern including an opening that exposes the predetermined region ofthe active region; forming a semiconductor pattern in the opening;forming a heater electrode pattern on the semiconductor pattern and inthe opening; forming a contact hole spaced apart from the opening,wherein the contact hole exposes the conductive pattern; forming acontact plug to substantially fill the contact hole; and forming a phasechange material layer on the heater electrode pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A through 1J are cross-sectional views illustrating an exemplarymethod of fabricating a semiconductor device according to oneembodiment; and

FIGS. 2A through 2J are cross-sectional views illustrating an exemplarymethod of fabricating a semiconductor device according to anotherembodiment.

DETAILED DESCRIPTION

Embodiments of the present invention will now be described more fullyhereinafter with reference to the accompanying drawings. Theseembodiments, however, may be realized in many different forms and shouldnot be construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the thicknesses of layers andregions are exaggerated for clarity. It will also be understood thatwhen a layer is referred to as being “on” another layer or substrate, itcan be directly on the other layer or substrate, or intervening layersmay also be present. Like numbers refer to like elements throughout.

FIGS. 1A through 1J are cross-sectional views illustrating an exemplarymethod of fabricating a semiconductor device, such as a phase changememory device, according to one embodiment.

Referring to FIG. 1A, a device isolation layer (not shown) is formed todefine an active region in a semiconductor substrate 110. The activeregion may function as a lower conductive region of a semiconductordevice. Accordingly, the active region may be used as an interconnection(e.g., a wordline) formed to connect phase change random access memorycells in a predetermined direction. When functioning as aninterconnection, the active region may receive a power through a contactplug formed in a subsequent process. The active region may include animpurity region that is heavily doped with impurities having a differentconductivity type from the semiconductor substrate 110. For example,where the conductivity type of the semiconductor substrate 110 isP-type, the active region may include N⁺-type impurity region.

Referring to FIG. 1B, a metal layer 112 and a reaction barrier layer 114are formed to cover the semiconductor substrate 110 in which the activeregion is defined. In one embodiment, the metal layer 112 may be formedto facilitate the forming of a metal silicide layer on the active regionof the semiconductor substrate 110. Thus, the metal layer 112 mayinclude a silicidable material such as cobalt (Co), or the like. Thereaction barrier layer 114 may substantially prevent the metal layer 112from being oxidized by an external environment. In one embodiment, thereaction barrier layer 114 may include a material such as, titaniumnitride (TiN), or the like.

Referring to FIG. 1C, the active region of the semiconductor substrate110 is reacted with the metal layer 112 to form a conductive layer 115that is a metal silicide layer. In one embodiment, the conductive layer115 may include cobalt silicide (CoSi). The reaction barrier layer 114and unreacted portions of the metal layer 112 are then removed by meansof a strip process. The strip process may include, for example, a wetetch process. Thus, a conductive layer 115 may be formed to cover theactive region of the semiconductor substrate 110.

Referring to FIG. 1D, an interlayer dielectric layer is formed on theconductive layer 115. The interlayer dielectric layer is patterned toform an interlayer dielectric pattern 120, which includes an opening 121formed to expose a predetermined region of the conductive layer 115. Theinterlayer dielectric layer may include a material such as silicon oxide(SiO₂), silicon nitride (SiN), silicon oxynitride (SiON), a low-kdielectric material, or the like or a combination thereof. Theinterlayer dielectric pattern 120 may be a single layer of silicon oxideor a triple layer of silicon oxide-silicon nitride-silicon oxide. In theillustrated embodiment, the interlayer dielectric layer is a triplelayer comprising a first silicon oxide layer 116, a silicon nitridelayer 117, and a second silicon oxide layer 118 that are stacked in theorder listed.

The opening 121 may be formed by forming a mask pattern (not shown) onthe interlayer dielectric layer and anisotropically etching theinterlayer dielectric layer using the mask pattern as an etch mask.After anisotropically etching the interlayer dielectric layer, a portionof the conductive layer 115 is exposed by the opening 121. Theanisotropic etch is performed with an etch selectivity to the activeregion of the semiconductor substrate 110.

Referring to FIG. 1E, the conductive layer 115 exposed by the opening121 is removed to form a conductive pattern 115 a. Thus, a predeterminedregion of the active region of the semiconductor substrate 110 may beexposed. The exposed conductive layer 115 may be removed using a wetetch process using hydrofluoric acid (HF) as an etch solution. Duringthe removal of the exposed conductive layer 115, a lower portion of theopening 121 may extend underneath the interlayer dielectric pattern 120.That is, the opening 121 may include an undercut portion below theinterlayer dielectric pattern 120.

Referring to FIG. 1F, a spacer 122 is formed on an inner sidewall of theopening 121 to expose the predetermined region of the active region ofthe semiconductor substrate 110. The spacer 122 substantially fills theundercut portion formed during the removal of the exposed conductivelayer 115 to improve a reliability of a subsequently formedsemiconductor device (e.g., a phase change memory device). The formationof the spacer 122 may be omitted in embodiments where a semiconductorlayer such as polysilicon is formed in a subsequent process. The spacer122 may include a material such as, for example, silicon oxide.

Referring to FIG. 1G, a semiconductor layer 124 is formed tosubstantially fill the opening 121 having the inner sidewall on whichthe spacer 122 is formed. The semiconductor layer 124 may be formed by,for example, forming a semiconductor material layer covering theinterlayer dielectric pattern 120 and filling the opening 121 followedby patterning the semiconductor material layer. In one embodiment, thesemiconductor material layer may be patterned by planarized using apolishing process such as a chemical mechanical polishing (CMP) process.The semiconductor layer 124 may include a selective epitaxial growth(SEG) layer, a polysilicon layer, or the like or a combination thereof.

In one embodiment, an SEG layer may be formed by means of an epitaxialprocess using the predetermined region of the active region exposed bythe opening 121 as a seed layer and may include a material including oneor more Group IV elements, one or more Group Ill-V elements, or the likeor a combination thereof. For example, the semiconductor layer 124 maybe an epitaxial germanium-silicon layer or an epitaxial silicon layer.In one embodiment, a polysilicon layer may be formed using, for example,a chemical vapor deposition (CVD) process. In one embodiment, thesemiconductor layer 124 may be a selective epitaxial silicon layer.

Referring to FIG. 1H, the semiconductor layer 124 is recessed to form arecessed semiconductor layer (not shown) filling only a lower portion ofthe opening 121. The semiconductor layer 124 may be recessed by, forexample, etching the semiconductor layer 124 using an etch-back processuntil an upper sidewall of the opening 121 is exposed. According to oneembodiment, the height of a subsequently formed heater electrode isdetermined by the height of the upper sidewall of the opening 121 thatis exposed as a result of the recess process. That is, the height of asubsequently formed heater electrode is determined by the height of therecessed semiconductor layer present within the lower portion of theopening 121 after the recess process.

Impurity ions are implanted into the recessed semiconductor layerfilling the lower portion of the opening 121, thereby forming asemiconductor pattern. The semiconductor pattern may include a diode 125comprising a lower impurity region 124 n and an upper impurity region124 p. In one embodiment, the lower impurity region 124 n may be anN-type impurity region and the upper impurity region 124 p may be aP-type impurity region.

The semiconductor pattern may further include a metal silicide layer 124s formed on the diode 125. The metal silicide layer 124 s may lower aresistance at the boundary between the diode 125 and a subsequentlyformed heater electrode, thereby decreasing an operation current of thesemiconductor device. In one embodiment, the metal silicide layer 124 sis formed by depositing a metal layer having a high melting-point andreacting the recessed semiconductor layer with the metal layer during asiliciding process. Any unreacted portion of the metal layer during thesiliciding process may be removed in a strip process. The strip processmay include, for example, a wet etch process. The metal silicide layer124 s may include a material such as, for example, cobalt silicide,tungsten silicide (WSi_(x)), or the like or a combination thereof. Inone embodiment, the metal silicide layer 124 s may be formed of cobaltsilicide.

Referring to FIG. 1I, a heater electrode pattern is formed tosubstantially fill the opening 121 on the semiconductor pattern. Theheater electrode pattern may include a heater electrode 128 and a heaterelectrode spacer 126 surrounding the heater electrode 128. The heaterelectrode spacer 126 may be formed by depositing a thermally insulativematerial layer within the opening 121 and on the semiconductor pattern.The thermally insulative material layer may then be anisotropicallyetched in a dry etch process. The heater electrode 128 may be formed bydepositing a heater electrode material to substantially fill the opening121 where the heater electrode spacer 126. A patterning process may thenbe performed to form the heater electrode 128 with a narrowed crosssection. In one embodiment, the patterning process may include aplanarization process performed by means of a polishing process such asa CMP process. By forming the heater electrode 128 with a narrowed crosssection, the resistance of the heater electrode 128 may be increased.During the planarization process for forming the heater electrode 128,the second silicon oxide layer 118 may be removed.

As exemplarily shown in FIG. 11, the heater electrode 128 is connectedto the diode 125 and serves to heat a phase change material layer formedin a subsequent process. The heater electrode 128 may include, forexample, a metal nitride, a metal oxynitride, carbon (C), titanium (Ti),zirconium (Zr), tantalum (Ta), copper (Cu), tungsten (W), hafnium (Hf),molybdenum (Mo), aluminum (Al), aluminum titanium (AlTi), aluminum,copper alloy (Al—Cu), aluminum-copper-silicon ally (Al—Cu—Si), tungstentitanium (WTi), tungsten silicide (WSi_(x)), or the like, orcombinations thereof. The metal nitride may include, for example,titanium nitride (TiN), tantalum nitride (TaN), tungsten nitride (WN),molybdenum nitride (MoN), niobium nitride (NbN), titanium siliconnitride (TiSiN), titanium aluminum nitride (TiAlN), titanium boronnitride (TiBN), zirconium silicon nitride (ZrSiN), zirconium aluminumnitride (ZrAlN), tantalum silicon nitride (TaSiN), tantalum aluminumnitride (TaAlN), tungsten silicon nitride (WSiN), tungsten boron nitride(WBN), molybdenum silicon nitride (MoSiN), molybdenum aluminum nitride(MoAlN), or the like or a combination thereof. The metal oxynitride mayinclude, for example, titanium oxynitride (TiON), titanium aluminumoxynitride (TiAlON), tantalum oxynitride (TaON), tungsten oxynitride(WON), or the like or a combination thereof. In one embodiment, theheater electrode 128 may be formed of titanium nitride.

The heater electrode spacer 126 may serve to narrow the cross sectionalarea of the heater electrode 128 as well as reduce the conduction ofheat generated from the heater electrode 128. The heater electrodespacer 126 may include, for example, silicon oxide, silicon nitride, orthe like or a combination thereof. In one embodiment, the heaterelectrode spacer 126 may be formed of the silicon nitride.

A contact hole 129 may be formed to be spaced apart from the opening 121and to expose a portion of the conductive pattern 115 a. A contact plug130 is then formed to substantially fill the contact hole 129. Thecontact plug 130 may supply power to an interconnection formed toconnect phase change random access memory cells in a predetermineddirection. Accordingly, the interconnection may be a wordline connectingphase change random access memory cells, previously described withreference to FIG. 1A. Accordingly, the contact plug 130 may haveresistance which is about 10 times lower than in a structure that isdirectly connected to an active region of the semiconductor substrate110.

Referring to FIG. 1J, a phase change material layer 132 and a cappingelectrode 134 are sequentially formed on the resultant structure wherethe heater electrode 128 is formed. The phase change material layer 132and the capping electrode 134 may be formed by depositing a phase changematerial and a capping electrode material and patterning the same.

The phase change material layer 132 may include a chalcogenide compoundcontaining, for example, antimony (Sb), tellurium (Te), selenium (Se),or the like or a combination thereof. In one embodiment, the phasechange material layer 132 may be formed of Ge₂₂Sb₂₂Te₅₆.

The capping electrode 134 may, for example, include a metal nitride, ametal oxynitride, carbon (C), titanium (Ti), zirconium (Zr), tantalum(Ta), copper (Cu), tungsten (W), hafnium (Hf), molybdenum (Mo), aluminum(Al), aluminum titanium (AlTi), aluminum-copper alloy (Al—Cu),aluminum-copper-silicon ally (Al—Cu—Si), tungsten titanium (WTi),tungsten silicide (WSi_(x)), or the like or a combination thereof. Themetal nitride may, for example, titanium nitride (TiN), tantalum nitride(TaN), tungsten nitride (WN), molybdenum nitride (MoN), niobium nitride(NbN), titanium silicon nitride (TiSiN), titanium aluminum nitride(TiAlN), titanium boron nitride (TiBN), zirconium silicon nitride(ZrSiN), zirconium aluminum nitride (ZrAlN), tantalum silicon nitride(TaSiN), tantalum aluminum nitride (TaAlN), tungsten silicon nitride(WSiN), tungsten boron nitride (WBN), molybdenum silicon nitride(MoSiN), molybdenum aluminum nitride (MoAlN), or the like or acombination thereof. The metal oxynitride may, for example, includetitanium oxynitride (TiON), titanium aluminum oxynitride (TiAlON),tantalum oxynitride (TaON), tungsten oxynitride (WON), or the like or acombination thereof. In one embodiment, the capping electrode 134 may beformed of titanium nitride. A bitline (not shown) may be formed over thecapping electrode 134.

FIGS. 2A through 2J are cross-sectional views illustrating an exemplarymethod of fabricating a semiconductor device, such as a phase changememory device, according to another embodiment.

Referring to FIG. 2A, a device isolation layer (not shown) is formed todefine an active region in a semiconductor substrate 210. The activeregion may function as a lower conductive region of a semiconductordevice. Accordingly, the active region may be used as an interconnection(e.g., a wordline) formed to connect phase change random access memorycells in a predetermined direction. When functioning as aninterconnection, the active region may receive a power through a contactplug formed in a subsequent process. The active region may include animpurity region that is heavily doped with impurities having a differentconductivity type from the semiconductor substrate 210. For example,where the conductivity type of the semiconductor substrate 110 isP-type, the active region may include N⁺-type impurity region.

Referring to FIG. 2B, a silicide blocking pattern 211 is formed on theactive region of the semiconductor substrate 210 to expose a portion ofthe semiconductor substrate 210. The silicide blocking pattern 211 maysubstantially prevent a subsequently formed metal layer from reactingwith the semiconductor substrate 210 during a subsequent silicidationprocess performed to form a conductive pattern. The silicide blockingpattern 211 may include silicon oxide, silicon nitride, siliconoxynitride, a low-k dielectric material, or the like or a combinationthereof. In one embodiment, the silicon blocking pattern 211 may beformed of silicon nitride.

Referring to FIG. 2C, a metal layer 212 and a reaction barrier layer 214are formed to cover the semiconductor substrate 210 where the silicideblocking pattern 211 is formed. Thus, the metal layer 212 may include asilicidable material such as cobalt (Co), or the like. The reactionbarrier layer 214 may substantially prevent the metal layer 212 frombeing oxidized by an external environment. In one embodiment, thereaction barrier layer 214 may include a material such as, titaniumnitride (TiN), or the like.

Referring to FIG. 2D, portions of the active region of the semiconductorsubstrate 210 exposed by the silicide blocking pattern 211 react withthe metal layer 212 to form a conductive pattern 215 a that is a metalsilicide layer. In one embodiment, the conductive pattern 215 a mayinclude cobalt silicide (CoSi). The reaction barrier layer 214 andunreacted portions of the metal layer 212 are then removed by means of astrip process. The strip process may include, for example, a wet etchprocess. Thus, the silicide blocking pattern 211 and the conductivepattern 215 a may be formed to cover the active region of thesemiconductor substrate 210.

Referring to FIG. 2E, an interlayer dielectric layer is formed on thesilicide blocking pattern 211 and the conductive pattern 215 a. Theinterlayer dielectric layer is patterned to form an interlayerdielectric pattern 220, which includes an opening 221 formed to exposethe silicide blocking pattern 211. The interlayer dielectric layer mayinclude a material such as silicon oxide (SiO₂), silicon nitride (SiN),silicon oxynitride (SiON), a low-k dielectric material, or the like or acombination thereof. The interlayer dielectric pattern 220 may be asingle layer of silicon oxide or a triple layer of silicon oxide-siliconnitride-silicon oxide. In the illustrated embodiment, the interlayerdielectric layer is a triple layer comprising a first silicon oxidelayer 216, a silicon nitride layer 217, and a second silicon oxide layer218 that are stacked in the order listed.

The opening 221 may be formed by forming a mask pattern (not shown) onthe interlayer dielectric layer and anisotropically etching theinterlayer dielectric layer using the mask pattern as an etch mask.After anisotropically etching the interlayer dielectric layer, thesilicide blocking pattern 211 is exposed by the opening 221. Theanisotropic etch is performed with an etch selectivity to the activeregion of the semiconductor substrate 210.

The silicide blocking pattern 211 exposed by the opening 221 is removedto expose a predetermined region of the active region of thesemiconductor substrate 210. The exposed silicide blocking pattern 211may be removed using a wet etch process using phosphoric acid (H₃PO₄) asan etch solution. In an embodiment where the where the silicide blockingpattern 211 is formed of silicon oxide, the silicide blocking pattern211 may be removed during the formation of the interlayer dielectricpattern 220. Accordingly, the amount by which the conductive pattern 215a is removed during wet etching of the silicide blocking pattern 211 maybe suppressed. During the removal of the silicide blocking pattern 211,a lower portion of the opening 221 may extend underneath the interlayerdielectric pattern 220. That is, the opening 221 may include an undercutportion may below the interlayer dielectric pattern 220.

Referring to FIG. 2F, a spacer 222 is formed on an inner sidewall of theopening 221 to expose the predetermined region of the active region ofthe semiconductor substrate 210. The spacer 222 substantially fills theundercut portion formed during the removal of the silicide blockingpattern 211 to improve a reliability of a subsequently formedsemiconductor device (e.g., phase change memory device). The formationof the spacer 222 may be omitted in the case where a semiconductor layersuch as polysilicon is formed in a subsequent process. The spacer 222may include a material such as, for example, silicon oxide.

Referring to FIG. 2G, a semiconductor layer 224 is formed tosubstantially fill the opening 221 having the inner sidewall on whichthe spacer 222 is formed. The semiconductor layer 224 may be formed by,for example, forming a semiconductor material layer covering theinterlayer dielectric pattern 220 and filling the opening 221 followedby patterning the semiconductor material layer. In one embodiment, thesemiconductor material layer may be patterned by planarized using apolishing process such as a chemical mechanical polishing (CMP) process.The semiconductor layer 224 may include a selective epitaxial growth(SEG) layer, a polysilicon layer, or the like or a combination thereof.

In one embodiment, an SEG layer may be formed by means of an epitaxialprocess using the predetermined region of the active region exposed bythe opening 221 as a seed layer and may include a material including oneor more Group IV elements, one or more Group III-V elements, or the likeor a combination thereof. For example, the semiconductor layer 224 maybe an epitaxial germanium-silicon layer or an epitaxial silicon layer.In one embodiment, a polysilicon layer may be formed using, for example,a chemical vapor deposition (CVD) process. In one embodiment, thesemiconductor layer 224 may be a selective epitaxial silicon layer.

Referring to FIG. 2H, the semiconductor layer 224 is recessed to form arecessed semiconductor layer (not shown) filling only a lower portion ofthe opening 221. The semiconductor layer 224 may be recessed by, forexample, etching the semiconductor layer 224 using an etch-back processuntil an upper sidewall of the opening 221 is exposed. According to oneembodiment, the height of a subsequently formed heater electrode isdetermined by the height of the upper sidewall of the opening 221 thatis exposed as a result of the recess process. That is, the height of asubsequently formed heater electrode is determined by the height of therecessed semiconductor layer present within the lower portion of theopening 221 after the recess process.

Impurity ions are implanted into the recessed semiconductor layerfilling the lower portion of the opening 221, thereby forming asemiconductor pattern. The semiconductor pattern may include a diode 225comprising a lower impurity region 224 n and an upper impurity region224 p. In one embodiment, the lower impurity region 224 n may be anN-type impurity region and the upper impurity region 224 p may be aP-type impurity region.

The semiconductor pattern may further include a metal silicide layer 224s formed on the diode 225. The metal silicide layer 224 s may lower aresistance at the boundary between the diode 225 and a subsequentlyformed heater electrode, thereby decreasing an operation current of thesemiconductor device. In one embodiment, the metal silicide layer 224 sis formed by depositing a metal layer having a high melting-point andreacting the semiconductor layer 224 with the metal layer. Any unreactedportion of the metal layer during the siliciding process may be removedin a strip process. The strip process may include, for example, a wetetch process. The metal silicide layer 224 s may include a material suchas, for example, cobalt silicide, tungsten silicide (WSi_(x)) or thelike or a combination thereof. In one embodiment, the metal silicidelayer 224 s may be formed of cobalt silicide.

Referring to FIG. 2I, a heater electrode pattern is formed tosubstantially fill the opening 221 on the semiconductor pattern. Theheater electrode pattern may include a heater electrode 228 and a heaterelectrode spacer 226 surrounding the heater electrode 228. The heaterelectrode spacer 226 may be formed by depositing a thermally insulativematerial layer within the opening 221 and on the semiconductor pattern.The thermally insulative material layer may then be anisotropicallyetched in a dry etch process. The heater electrode 228 may be formed bydepositing a heater electrode material is formed to substantially fillthe opening 221 where the heater electrode spacer 226 is formed. Apatterning process may then be performed to form the heater electrode228 with a narrowed cross section. In one embodiment, the patterningprocess may include a planarization process performed by means of apolishing process such as a CMP process. By forming the heater electrode228 with a narrowed cross section, the resistance of the heaterelectrode 228 may be increased. During the planarization process forforming the heater electrode 228, the second silicon oxide layer 218 maybe removed.

As exemplarily shown in FIG. 2I, the heater electrode 228 is connectedto the diode 225 and serves to heat a phase change material layer formedin a subsequent process. The heater electrode 228 may include, forexample, a metal nitride, a metal oxynitride, carbon (C), titanium (Ti),zirconium (Zr), tantalum (Ta), copper (Cu), tungsten (W), hafnium (Hf),molybdenum (Mo), aluminum (Al), aluminum titanium (AlTi),aluminum-copper alloy (Al—Cu), aluminum-copper-silicon ally (Al—Cu—Si),tungsten titanium (WTi), tungsten silicide (WSi_(x)), or the like or acombination thereof. The metal nitride may include, for example,titanium nitride (TiN), tantalum nitride (TaN), tungsten nitride (WN),molybdenum nitride (MoN), niobium nitride (NbN), titanium siliconnitride (TiSiN), titanium aluminum nitride (TiAlN), titanium boronnitride (TiBN), zirconium silicon nitride (ZrSiN), zirconium aluminumnitride (ZrAlN), tantalum silicon nitride (TaSiN), tantalum aluminumnitride (TaAlN), tungsten silicon nitride (WSiN), tungsten boron nitride(WBN), molybdenum silicon nitride (MoSiN), molybdenum aluminum nitride(MoAlN), or the like or a combination thereof. The metal oxynitride mayinclude, for example, titanium oxynitride (TiON), titanium aluminumoxynitride (TiAlON), tantalum oxynitride (TaON), tungsten oxynitride(WON), or the like or a combination thereof. In one embodiment, theheater electrode 128 may be formed of titanium nitride.

The heater electrode spacer 226 may serve to narrow the cross sectionalarea of the heater electrode 228 as well as reduce the conduction ofheat generated from the heater electrode 228. The heater electrodespacer 226 may include, for example, silicon oxide, silicon nitride, orthe like or a combination thereof. In one embodiment, the heaterelectrode spacer 226 may be formed of the silicon nitride.

A contact hole 229 may be formed to be spaced apart from the opening 221and to expose a portion of the conductive pattern 215 a. A contact plug230 is then formed to substantially fill the contact hole 229. A contactplug 230 is then formed to substantially fill the contact hole 229. Thecontact plug 230 may supply power to an interconnection formed toconnect phase change random access memory cells in a predetermineddirection. Accordingly, the interconnection may be a wordline connectingphase change random access memory cells, previously described withreference to FIG. 2A. Accordingly, the contact plug 230 may haveresistance which is about 10 times lower than in a structure that isdirectly connected to an active region of the semiconductor substrate210.

Referring to FIG. 2J, a phase change material layer 232 and a cappingelectrode 234 are sequentially formed on the resultant structure wherethe heater electrode 228 is formed. The phase change material layer 232and the capping electrode 234 may be formed by depositing a phase changematerial and a capping electrode material and patterning the same.

The phase change material layer 232 may include a chalcogenide compoundcontaining, for example, antimony (Sb), tellurium (Te), selenium (Se),or the like or a combination thereof. In one embodiment, the phasechange material layer 232 may be formed of Ge₂₂Sb₂₂Te₅₆.

The capping electrode 234 may, for example, include a metal nitride, ametal oxynitride, carbon (C), titanium (Ti), zirconium (Zr), tantalum(Ta), copper (Cu), tungsten (W), hafnium (Hf), molybdenum (Mo), aluminum(Al), aluminum titanium (AlTi), aluminum-copper alloy (Al—Cu),aluminum-copper-silicon ally (Al—Cu—Si), tungsten titanium (WTi),tungsten silicide (WSi_(x)), or the like or a combination thereof. Themetal nitride may, for example, include titanium nitride (TiN), tantalumnitride (TaN), tungsten nitride (WN), molybdenum nitride (MoN), niobiumnitride (NbN), titanium silicon nitride (TiSiN), titanium aluminumnitride (TiAlN), titanium boron nitride (TiBN), zirconium siliconnitride (ZrSiN), zirconium aluminum nitride (ZrAlN), tantalum siliconnitride (TaSiN), tantalum aluminum nitride (TaAlN), tungsten siliconnitride (WSiN), tungsten boron nitride (WBN), molybdenum silicon nitride(MoSiN), molybdenum aluminum nitride (MoAlN), or the like or acombination thereof. The metal oxynitride may, for example, includetitanium oxynitride (TiON), titanium aluminum oxynitride (TiAlON),tantalum oxynitride (TaON), tungsten oxynitride (WON), or the like or acombination thereof. In one embodiment, the capping electrode 234 may beformed of titanium nitride. A bitline (not shown) may be formed over thecapping electrode 234.

According to the embodiments exemplarily described above, a metalsilicide layer is provided on the entire surface of an active region ofa semiconductor substrate except at a region corresponding to thelocation of a diode. Thus, a resistance of the active region can be atleast five times lower than a resistance of an active regioncorresponding to an impurity region. As a result, an operation currentof the semiconductor device (e.g., the phase change memory device) canbe improved to achieve the superior operation characteristics and isapplicable to high integration.

In addition, a metal silicide layer can also be connected to a contactplug. Thus, the contact resistance of the semiconductor device (e.g., aphase change memory device) can be about 10 times lower than a contactresistance of a structure that is directly connected to a semiconductorsubstrate. As a result, operation current of the semiconductor device(e.g., the phase change memory device) is improved to achieve superioroperation characteristics and high integration.

Although embodiments have been exemplarily described in connection withthe illustrated in the accompanying drawings, the embodiments are notlimited to the description expressly provided herein. It will beapparent to those skilled in the art that various substitutions,modifications and changes may be made without departing from the scopeand spirit of the invention.

1. A semiconductor device comprising: a semiconductor substrateincluding an active region; a conductive pattern disposed on thesemiconductor substrate, wherein a predetermined region of the activeregion is exposed by the conductive pattern; an interlayer dielectricpattern provided on the conductive pattern, the interlayer dielectricpattern including an opening and a contact hole spaced apart from theopening, wherein the opening exposes the predetermined region of theactive region and the contact hole exposes the conductive pattern; asemiconductor pattern provided in the opening and electrically connectedto the exposed active region; a heater electrode pattern provided in theopening and electrically connected to the semiconductor pattern; acontact plug substantially filling the contact hole and connected to theconductive pattern; and a phase change material layer provided on theheater electrode pattern.
 2. The semiconductor device as recited inclaim 1, wherein the conductive pattern includes a metal silicide. 3.The semiconductor device as recited in claim 1, further comprising aspacer provided on an inner sidewall of the opening.
 4. Thesemiconductor device as recited in claim 1, wherein the semiconductorpattern includes a diode.
 5. The semiconductor device as recited inclaim 4, further comprising a metal silicide layer provided on thediode.
 6. The semiconductor device as recited in claim 1, wherein theheater electrode pattern includes a heater electrode and a heaterelectrode spacer surrounding the heater electrode.
 7. A method forfabricating a semiconductor device, comprising: forming an active regionin a semiconductor substrate; forming a conductive pattern exposing apredetermined region of the active region; forming an interlayerdielectric pattern on the conductive pattern, the interlayer dielectricpattern including an opening that exposes the predetermined region ofthe active region; forming a semiconductor pattern in the opening;forming a heater electrode pattern on the semiconductor pattern in theopening; forming a contact hole spaced apart from the opening, whereinthe contact hole exposes the conductive pattern; forming a contact plugto substantially fill the contact hole; and forming a phase changematerial layer on the heater electrode pattern.
 8. The method as recitedin claim 7, wherein forming the conductive pattern comprises: forming aconductive layer covering the predetermined region of the active region;forming the interlayer dielectric pattern including the opening, whereinthe opening exposes the conductive layer over the predetermined regionof the active region; and removing the conductive layer exposed by theopening.
 9. The method as recited in claim 8, wherein removing theconductive layer includes wet etching the conductive layer usinghydrofluoric acid (HF) as an etch solution.
 10. The method as recited inclaim 9, wherein the conductive layer includes metal silicide.
 11. Themethod as recited in claim 7, wherein forming the conductive pattern andthe interlayer dielectric comprises: forming a silicide blocking layerover the predetermined region of the active region, the silicideblocking layer exposing a portion of the semiconductor substrate;forming a metal silicide pattern on the exposed portion of thesemiconductor substrate; forming the interlayer dielectric patternincluding the opening, wherein the opening exposes the silicide blockingpattern; and removing the silicide blocking pattern exposed by theopening.
 12. The method as recited in claim 11, wherein the silicideblocking pattern includes silicon oxide, silicon nitride, siliconoxynitride, a low-k dielectric material or a combination thereof. 13.The method as recited in claim 11, wherein the silicide blocking patternis removed during the formation of the interlayer dielectric patternincluding the opening.
 14. The method as recited in claim 7, furthercomprising forming a spacer on an inner sidewall of the opening.
 15. Themethod as recited in claim 7, wherein forming the semiconductor patternand forming the heater electrode pattern comprises: forming asemiconductor layer within a lower portion of the opening; implantingimpurity ions into the semiconductor layer to form the semiconductorpattern; and forming the heater electrode pattern on the semiconductorpattern, wherein the heater electrode pattern substantially fills theopening.
 16. The method as recited in claim 15, wherein thesemiconductor layer includes an epitaxially grown material, polysilicon,or a combination thereof.
 17. The method as recited in claim 15, whereinthe semiconductor pattern includes a diode.
 18. The method as recited inclaim 17, further comprising forming a metal silicide layer on thediode.
 19. The method as recited in claim 15, wherein the heaterelectrode pattern includes a heater electrode and a heater electrodespacer surrounding the heater electrode.